Projects funded by the NCN
Copper conductive lines with glass insulation by a melt extrusion process
2022/04/Y/ST7/00151
Keywords:
melt extrusion process copper glass electrical properties adhesion interface
Descriptors:
- :
Panel:
ST7 - Systems and communication engineering: electronics, communication, optoelectronics
Host institution :
Politechnika Wrocławska
woj. dolnośląskie
Principal investigator (from the host institution):
Number of co-investigators in the project: 1
Call: M-ERA.NET 3 Call 2022 - announced on 2011-01-01
Amount awarded: 605 866 PLN
Project start date (Y-m-d): 2010-01-01
Project end date (Y-m-d): 2010-01-01
Project duration:: 0 months (the same as in the proposal)
Project status: Pending project
Project description
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