Projects funded by the NCN

Information on the principal investigator and host institution

Information of the project and the call

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Deciphering laser-microstructure interaction in multicomponent alloys

2021/42/E/ST5/00339

Keywords:

Microstructure Big Data Interfacial Phenomena Multicomponent Alloys Multiscale Models Laser Processing

Descriptors:

  • ST5_8: Metals, alloys
  • ST6_12: Scientific computing, simulation and modelling tools
  • ST8_3: Computational engineering, computer-aided modelling, design and manufacturing

Panel:

ST5 - Materials: materials synthesis, structure-properties relations, advanced and functional materials with designed properties, (macro)molecular architecture, material engineering

Host institution :

Politechnika Śląska, Wydział Mechaniczny Technologiczny

woj.

Other projects carried out by the institution 

Principal investigator (from the host institution):

dr Anil Kunwar 

Number of co-investigators in the project: 6

Call: SONATA BIS 11 - announced on 2021-06-15

Amount awarded: 2 510 720 PLN

Project start date (Y-m-d): 2022-03-29

Project end date (Y-m-d): 2026-03-28

Project duration:: 48 months (the same as in the proposal)

Project status: Pending project

Project description

Download the project description in a pdf file

Note - project descriptions were prepared by the authors of the applications themselves and placed in the system in an unchanged form.

Information in the final report

  • Publication in academic press/journals (14)
  • Articles in post-conference publications (2)
  1. Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation
    Authors:
    Shuibao Liang, Anil Kunwar, Changqing Liu, Han Jiang, Zhaoxia Zhou
    Academic press:
    Journal of Materials Research and Technology (rok: 2022, tom: 19, strony: 345-353), Wydawca: Elsevier B.V.
    Status:
    Published
    DOI:
    10.1016/j.jmrt.2022.05.047 - link to the publication
  2. PiezoTensorNet: Crystallography informed multi-scale hierarchical machine learning model for rapid piezoelectric performance finetuning
    Authors:
    Sachin Poudel, Rubi Thapa, Rabin Basnet, Anna Timofiejczuk, Anil Kunwar
    Academic press:
    Applied Energy (rok: 2024, tom: 361, strony: 122901), Wydawca: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.apenergy.2024.122901 - link to the publication
  3. Automatic Featurization Aided Data-Driven Method for Estimating the Presence of Intermetallic Phase in Multi-Principal Element Alloys
    Authors:
    Upadesh Subedi, Yuri Amorim Coutinho, Prafulla Bahadur Malla, Khem Gyanwali, Anil Kunwar
    Academic press:
    Metals (rok: 2022, tom: 12, strony: 964), Wydawca: MDPI
    Status:
    Published
    DOI:
    10.3390/met12060964 - link to the publication
  4. Laser assisted fabrication of mechanochemically robust Ti3Au intermetallic at Au-Ti interface
    Authors:
    Oktawian Bialas, Augustine NS Appiah, Marta Wala, Anil Kunwar, Anna Woźniak, Paweł M Nuckowski, Wojciech Simka, Peter Råback, Marcin Adamiak
    Academic press:
    Engineering Science and Technology, an International Journal (rok: 2023, tom: 42, strony: 101413), Wydawca: Elsevier B.V.
    Status:
    Published
    DOI:
    10.1016/j.jestch.2023.101413 - link to the publication
  5. 3D printed biomedical devices and their applications: A review on state-of-the-art technologies, existing challenges, and future perspectives
    Authors:
    Hana Beyene Mamo, Marcin Adamiak, Anil Kunwar
    Academic press:
    Journal of the Mechanical Behavior of Biomedical Materials (rok: 2023, tom: 143, strony: 105930), Wydawca: Elsevier B.V.
    Status:
    Published
    DOI:
    10.1016/j.jmbbm.2023.105930 - link to the publication
  6. Automatic Featurization Aided Data-Driven Method for Estimating the Presence of Intermetallic Phase in Multi-Principal Element Alloys
    Authors:
    Upadesh Subedi, Yuri Amorim Coutinho, Prafulla Bahadur Malla, Khem Gyanwali, Anil Kunwar
    Academic press:
    Metals (rok: 2022, tom: 12, strony: 964), Wydawca: MDPI
    Status:
    Published
    DOI:
    10.3390/met12060964 - link to the publication
  7. A topical review on AI-interlinked biodomain sensors for multi-purpose applications
    Authors:
    Rubi Thapa, Sachin Poudel, Katarzyna Krukiewicz, Anil Kunwar
    Academic press:
    Measurement (rok: 2024, tom: 227, strony: 114123), Wydawca: Elsevier B.V.
    Status:
    Published
    DOI:
    10.1016/j.measurement.2024.114123 - link to the publication
  8. State-of-the-Art Review on the Aspects of Martensitic Alloys Studied via Machine Learning
    Authors:
    Upadesh Subedi, Sachin Poudel, Khem Gyanwali, Yuri Amorim Coutinho, Grzegorz Matula, Anil Kunwar
    Academic press:
    Metals (rok: 2022, tom: 12, strony: 1884), Wydawca: MDPI
    Status:
    Published
    DOI:
    10.3390/met12111884 - link to the publication
  9. Rapid portabilization of elasto-chemical evolution data for dental Ti-Cr alloy microstructure through sparsification and tensor computation
    Authors:
    Upadesh Subedi, Nele Moelans, Tomasz Tański, Anil Kunwar
    Academic press:
    Scripta Materialia (rok: 2024, tom: 244, strony: 116027), Wydawca: Elsevier B.V.
    Status:
    Published
    DOI:
    10.1016/j.scriptamat.2024.116027 - link to the publication
  10. AlloyManufacturingNet for discovery and design of hardness-elongation synergy in multi-principal element alloys
    Authors:
    Sachin Poudel, Upadesh Subedi, Mohammed OA Hamid, Khem Gyanwali, Nele Moelans, Anna Timofiejczuk, Anil Kunwar
    Academic press:
    Engineering Applications of Artificial Intelligence (rok: 2024, tom: 132, strony: 107902), Wydawca: Elsevier B.V.
    Status:
    Published
    DOI:
    10.1016/j.engappai.2024.107902 - link to the publication
  11. Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing
    Authors:
    Shuibao Liang, Cheng Wei, Anil Kunwar, Upadesh Subedi, Han Jiang, Haoran Ma, Changbo Ke
    Academic press:
    Surfaces and Interfaces (rok: 2023, tom: 37, strony: 102728), Wydawca: Elsevier B.V.
    Status:
    Published
    DOI:
    10.1016/j.surfin.2023.102728 - link to the publication
  12. Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation
    Authors:
    Shuibao Liang, Anil Kunwar, Changqing Liu, Han Jiang, Zhaoxia Zhou
    Academic press:
    Journal of Materials Research and Technology (rok: 2022, tom: 19, strony: 345-353), Wydawca: Elsevier B.V.
    Status:
    Published
    DOI:
    10.1016/j.jmrt.2022.05.047 - link to the publication
  13. Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing
    Authors:
    Shuibao Liang, Cheng Wei, Anil Kunwar, Upadesh Subedi, Han Jiang, Haoran Ma, Changbo Ke
    Academic press:
    Surfaces and Interfaces (rok: 2023, tom: 37, strony: 102728), Wydawca: Elsevier B.V.
    Status:
    Published
    DOI:
    10.1016/j.surfin.2023.102728 - link to the publication
  14. State-of-the-Art Review on the Aspects of Martensitic Alloys Studied via Machine Learning
    Authors:
    Upadesh Subedi, Sachin Poudel, Khem Gyanwali, Yuri Amorim Coutinho, Grzegorz Matula, Anil Kunwar
    Academic press:
    Metals (rok: 2022, tom: 12, strony: 1884), Wydawca: MDPI
    Status:
    Published
    DOI:
    10.3390/met12111884 - link to the publication
  1. Crystal structure informed mesoscale deformation model for HCP Cu6Sn5 intermetallic compound
    Authors:
    Anil Kunwar, Haoran Ma, Johan Hektor
    Conference:
    2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (rok: 2022, tom: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), strony: 45661), Wydawca: IEEE
    Data:
    konferencja 10-13 August 2022
    Status:
    Published
    DOI:
    10.1109/ICEPT56209.2022.9873310 - link to the publication
  2. Crystal structure informed mesoscale deformation model for HCP Cu6Sn5 intermetallic compound
    Authors:
    Anil Kunwar, Haoran Ma, Johan Hektor
    Conference:
    2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (rok: 2022, tom: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), strony: 45661), Wydawca: IEEE
    Data:
    konferencja 10-13 August 2022
    Status:
    Published
    DOI:
    10.1109/ICEPT56209.2022.9873310 - link to the publication

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