Projects funded by the NCN
Modeling of Electromagnetic Interactions in Modern (More-Than-Moore) Three-dimensionally Integrated Semiconductor Structures
2013/11/B/ST7/01742
Keywords:
time-space approximation electromagnetic compatibility modeling and analysis of semiconductor structues three-dimensional integrated circuits - 3D IC
Descriptors:
- ST7_3: Simulation engineering and modelling
- ST7_5: Micro- and nanelectronic, optoelectronic and photonic components
- ST6_12: Scientific computing, simulation and modelling tools
Panel:
ST7 - Systems and communication engineering: electronics, communication, optoelectronics
Host institution :
Politechnika Łódzka, Wydział Elektrotechniki, Elektroniki, Informatyki i Automatyki
woj. łódzkie
Principal investigator (from the host institution):
Number of co-investigators in the project: 7
Call: OPUS 6 - announced on 2013-09-16
Amount awarded: 594 800 PLN
Project start date (Y-m-d): 2014-09-19
Project end date (Y-m-d): 2018-09-18
Project duration:: 48 months (the same as in the proposal)
Project status: Project settled