Numerical modelling of heat transfer influence on the microstructure of nano-composite joints soldered with vapour phase soldering
2022/47/B/ST5/00997
Keywords
Descriptors
- ST7_003: Inżynieria symulacji i modelowania
- ST5_008: Metale, stopy
- ST5_013: Metody badań materiałów /nanomateriałów
Panel
ST5 – Materials: materials synthesis, structure-properties relations, advanced and functional materials with designed properties, (macro)molecular architecture, material engineering
Host institution
Sieć Badawcza ŁUKASIEWICZ - Instytut Mikroelektroniki i Fotoniki
Voivodeship: mazowieckie
Principal investigator (from the host institution)
Number of co-investigators in the project: 4
Call
OPUS 24 – announced on 2022-07-15
- Amount awarded
- 1 065 060 PLN
- Project start date
- 2023-07-06
- Project end date
- 2026-07-05
- Project duration
- 36 months (the same as in the proposal)
- Project status
- Pending project
Project description
Download the project description in a pdf file
Note — project descriptions were prepared by the authors of the applications themselves and placed in the system in an unchanged form.
Information in the final report
Publication in academic press/journals (8)
-
Sn Whisker Growth Mitigation by Modifying the Composition of the Solder Alloys: A Brief Review
- Authors:
- Balázs Illés, Halim Choi, Karel Dusek
- Academic press:
- Materials (year: 2025, volume: 18, pages: 1130), Publisher: MDPI
- Status:
- Published
- DOI:
- 10.3390/ma18051130 – link to the publication
-
Dispersion and incorporation of TiO2 and SiC nano-particles in SAC alloy: SIMS and DFT study
- Authors:
- Balázs Illés, Paweł Piotr Michałowski, Agata Skwarek, Halim Choi, Jaeduk Byun, Karel Dušek, David Bušek, Adrian Pietruszka
- Academic press:
- Scripta Materialia (year: 2024, volume: 243, pages: 115987), Publisher: Elsevier
- Status:
- Published
- DOI:
- 10.1016/j.scriptamat.2024.115987 – link to the publication
-
Numerical simulation of Sn grain growth in composite solder joint using a modified cellular automaton model
- Authors:
- István Bozsóki, Balázs Illés, Attila Géczy
- Academic press:
- Results in Engineering (year: 2025, volume: 26, pages: 104669), Publisher: Elsevier
- Status:
- Published
- DOI:
- 10.1016/j.rineng.2025.104669 – link to the publication
-
Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring
- Authors:
- Gergő Havellant, Balázs Illés, David Bušek, Attila Géczy
- Academic press:
- Case studies in thermal engineering (year: 2024, volume: 57, pages: 104315), Publisher: Elsevier
- Status:
- Published
- DOI:
- 10.1016/j.csite.2024.104315 – link to the publication
-
Influence of Fe-Nanoparticle Doped Flux on Electromigration Effects in SAC305 Solder Joints
- Authors:
- Irina Wodak, Attila Géczy, Oliver Krammer, Balázs Illés, Paweł Piotr Michałowski, Zoltán Tafferner, Golta Khatibi, Andriy Yakymovych
- Academic press:
- Journal of Materials Research and Technology (year: 2025, volume: 38, pages: 5866-5877), Publisher: Elsevier
- Status:
- Published
- DOI:
- 10.1016/j.jmrt.2025.09.054 – link to the publication
-
Electrical characterization of thermal vacuum grown submicron-thick Sn whiskers
- Authors:
- Agata Skwarek, Balázs Illés, Ernest Brzozowski, Adam Łaszcz, Piotr Zachariasz
- Academic press:
- Materials & Design (year: 2025, volume: 257, pages: 114528), Publisher: Elsevier
- Status:
- Published
- DOI:
- 10.1016/j.matdes.2025.114528 – link to the publication
-
Effects of ZrO2 Nano-Particles' Incorporation into SnAgCu Solder Alloys: An Experimental and Theoretical Study
- Authors:
- Agata Skwarek, Halim Choi, Tamás Hurtony, Jaeduk Byun, Ahmad Azmin Mohamad, David Bušek, Karel Dušek, Balázs Illés
- Academic press:
- Nanomaterials (year: 2024, volume: 14, pages: 1636), Publisher: MDPI
- Status:
- Published
- DOI:
- 10.3390/nano14201636 – link to the publication
-
Effect of ZrO2 and CuO nanoparticles on corrosion-induced Sn whisker grwoth from SnAgCu alloys: an experimental and quantum mechanical study
- Authors:
- Balázs Illés, Krzysztof Szostak, Halim Choi, Agata Skwarek
- Academic press:
- Materials & Design (year: 2025, volume: 260, pages: 115294), Publisher: Elsevier
- Status:
- Published
- DOI:
- 10.1016/j.matdes.2025.115294 – link to the publication
Articles in post-conference publications (3)
-
Low Temperature Soldering (LTS) in the Electronics Industry: a Brief Review
- Authors:
- Balázs Illés, Attila Géczy, Zoltán Tafferner, Agata Skwarek, Olivér Krammer,
- Conference:
- 48th IEEE International Spring Seminar on Electronics Technology (year: 2025, volume: 48th IEEE International Spring Seminar on Electronics Technology, pages: 46028), Publisher: IEEE
- Date:
- conference 14-18 May, 2025
- Status:
- Published
- DOI:
- 10.1109/ISSE65583.2025.11120985 – link to the publication
-
Development and characterization of Sn99Ag0.3Cu0.7-(ZrO2/CuO/TiO2) nano-composite solder alloys
- Authors:
- Balázs Illés, Halim Choi, Agata Skwarek
- Conference:
- Proceedings of SMTA Pan Pac Strategic Electronics Symposium (year: 2024, volume: 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific), pages: 91-98), Publisher: IEEE
- Date:
- conference 29.01-01.02.2024
- Status:
- Published
- DOI:
- 10.23919/PanPacific60013.2024.10436525 – link to the publication
-
Comparing the solderability of different SAC0307 composite solder pastes
- Authors:
- Balázs Illés, Halim Choi, Agata Skwarek
- Conference:
- Proceedings of 24th EMPC conference (year: 2023, volume: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), pages: 46027), Publisher: IEEE
- Date:
- conference 11-14.09.2023
- Status:
- Published
- DOI:
- 10.23919/EMPC55870.2023.10418438 – link to the publication