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Modelling of thermal phenomena in electronic nanosystems.

2016/21/B/ST7/02247

Keywords

Descriptors

  • ST7_5: Mikro- i nanoelektronika, optoelektronika
  • ST7_3: Inżynieria symulacji i modelowania
  • ST7_2: Elektrotechnika, elektronika: półprzewodniki, elementy i układy, systemy

Panel

ST7 – Systems and communication engineering: electronics, communication, optoelectronics

Host institution

Politechnika Łódzka, Wydział Elektrotechniki, Elektroniki, Informatyki i Automatyki

Voivodeship: łódzkie

Other projects carried out by the institution »

Principal investigator (from the host institution)

prof. Andrzej Krzysztof Napieralski

Number of co-investigators in the project: 10

Call

OPUS 11 – announced on 2016-03-15

Amount awarded
827 100 PLN
Project start date
2017-04-10
Project end date
2021-04-09
Project duration
48 months (the same as in the proposal)
Project status
Project settled

Project description

Download the project description in a pdf file

Note — project descriptions were prepared by the authors of the applications themselves and placed in the system in an unchanged form.

Equipment purchased [PL]

  1. Komputer do przeprowadzania symulacji termicznych z wykorzystaniem metody różnic skończonych.. Cost: 8 000 PLN
  2. Komputer o dużej mocy obliczeniowej waraz z oprogramowaniem COMSOL.. Cost: 14 000 PLN
  3. Komputer wraz z licencją i oprogramowaniem do symulacji komputerowych Metodą Elementów Skończonych: COMSOL lub SOLIDWORKS. Cost: 30 000 PLN
  4. Komputer wraz z licencją i oprogramowaniem do symulacji komputerowych Metodą Elementów Skończonych: FlexPDE.
  5. Komputer wraz z oprogramowaniem Matlab do opracowania algorytmów estymacji parametrów modeli oraz uzyskiwania rozwiązań analitycznych.. Cost: 12 000 PLN

Information in the final report

Publication in academic press/journals (5)

  1. Active calibration reference of minimized height for characterization of scanning thermal microscopy systems

    Authors:
    Paweł Janus, Dariusz Szmigiel, Andrzej Sierakowski, Maciej Rudek, Teodor Gotszalk
    Academic press:
    Ultramicroscopy (year: 2021, volume: 221, pages: 188-191), Publisher: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.ultramic.2020.113188 – link to the publication

  2. Analysis of Algorithm Efficiency for Heat Diffusion at Nanoscale Based on a MEMS Structure Investigation

    Authors:
    Raszkowski Tomasz,Zubert Mariusz
    Academic press:
    Energies (year: 2020, volume: 13, pages: 15), Publisher: MDPI
    Status:
    Published
    DOI:
    10.3390/en13102520 – link to the publication

  3. Investigation of Heat Diffusion at Nanoscale Based on Thermal Analysis of Real Test Structure

    Authors:
    Raszkowski Tomasz,Zubert Mariusz:
    Academic press:
    Energies (year: 2020, volume: 13, pages: 18), Publisher: MDPI
    Status:
    Published
    DOI:
    10.3390/en13092379 – link to the publication

  4. Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs

    Authors:
    Mariusz Zubert, Tomasz Raszkowski, Agnieszka Samson, Piotr Zając
    Academic press:
    Microelectronics Reliability (year: 2018, volume: Volume 91, pages: Pages 139-153), Publisher: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.microrel.2018.07.141 – link to the publication

  5. Influence of temperature and heat flux time lags on the temperature distribution in modern GAAFET structure based on Dual-Phase-Lag thermal model

    Authors:
    Tomasz Raszkowski, Agnieszka Samson, Mariusz Zubert
    Academic press:
    Microelectronics Reliability (year: 2018, volume: Volume 86, pages: Pages 10-19), Publisher: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.microrel.2018.05.004 – link to the publication

Articles in post-conference publications (9)

  1. Measurement and Simulation of MEMS Dedicated to Investigation of Heat Transfer at Nanoscale

    Authors:
    Marcin Janicki, Piotr Pietrzak, Jedrzej Topilko, Piotr Zajac, Artur Sobczak, Grzegorz Jablonski, Pawel Janus, Piotr Prokaryn, Andrzej Napieralski
    Conference:
    19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (year: 2018, pages: Chapter 10, Paper 074, pp. 1-4), Publisher: IEEE
    Date:
    conference 15-18 April
    Status:
    Published

  2. Manufacturing and Characterisation of MEMS Test Nanostructures

    Authors:
    Grzegorz Jabłoński, Paweł Janus, Piotr Pietrzak, Tomasz Torzewicz, Artur Sobczak, Marcin Janicki, Andrzej Napieralski, Andrzej Sierakowski, Anna Brzezińska, Piotr Prokaryn
    Conference:
    23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (year: 2017, pages: Paper ST11A-2), Publisher: IEEE
    Date:
    conference 27-29 September
    Status:
    Published

  3. Comparison of temperature distributions in modern nanostructures based on different parameters of Dual-Phase-Lag equation

    Authors:
    Tomasz Raszkowski, Agnieszka Samson, Mariusz Zubert, Marcin Janicki
    Conference:
    20th IEEE Electronics Packaging Technology Conference (EPTC) (year: 2018, pages: 290-295), Publisher: IEEE
    Date:
    conference 4-7 Dec.
    Status:
    Published

  4. Determining Parameters of the Dual-Phase-Lag Model of Heat Flow

    Authors:
    Mariusz Zubert, Tomasz Raszkowski, Jędrzej Topiłko, Łukasz Starzak, Grzegorz Jabłoński Paweł Janus, Marcin Janicki, Andrzej Napieralski
    Conference:
    25th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES) (year: 2018, pages: 225-230), Publisher: IEEE
    Date:
    conference 21-23 June
    Status:
    Published

  5. Measurement and Modeling of Heat Conduction in MEMS Nanostructures

    Authors:
    Marcin Janicki, Paweł Janus, Piotr Pietrzak, Piotr Zajac, Grzegorz Jablonski, Artur Sobczak, Jedrzej Topiłko, Andrzej Napieralski
    Conference:
    17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (year: 2018, pages: 196-201), Publisher: IEEE
    Date:
    conference May 29 - June 1
    Status:
    Published

  6. Analysis of Heat Transfer Processes in Electronic Nanostructures Using The Dual-Phase-Lag Model

    Authors:
    Marcin Janicki, Artur Sobczak, Grzegorz Jabłoński
    Conference:
    28th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES) (year: 2021, pages: 155-158), Publisher: IEEE
    Date:
    conference 24-26 June
    Status:
    Published

  7. Manufacturing and Characterization of Test Structures Dedicated for The Investigation of Heat Transfer Processes at Nanoscale

    Authors:
    J. Topiłko, A. Sobczak, P. Pietrzak, P. Zając, M. Janicki, P. Janus, M. Zubert, A. Napieralski
    Conference:
    25th International Workshop on Thermal Investigations of ICs and Systems THERMINIC (year: 2019, pages: Paper S07-5), Publisher: IEEE
    Date:
    conference 25-27 September
    Status:
    Published

  8. Measurement and Simulation of Test Structures Dedicated to the Investigation of Heat Diffusion at Nanoscale,

    Authors:
    M. Janicki, J. Topilko, A. Sobczak, P. Zajac, P. Pietrzak, A. Napieralski
    Conference:
    20th Annual International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE (year: 2019, pages: 269-272), Publisher: IEEE
    Date:
    conference March 24-27
    Status:
    Published

  9. Assessment of Different Methodologies for The Estimation of DPL Model Parameter Values for Dynamic Thermal Simulations of Nanoscale Electronic Structures

    Authors:
    Marcin Janicki, Mariusz Zubert, Piotr Zajac, Tomasz Raszkowsk, Jedrzej Topilko, Piotr Pietrzak, Grzegorz Jablonski, Agnieszka Samson, Andrzej Napieralski
    Conference:
    24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (year: 2018, pages: Paper S10-2), Publisher: IEEE
    Date:
    conference 26-28 September
    Status:
    Published

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