Projects funded by the NCN


Information on the principal investigator and host institution

Information of the project and the call

Keywords

Equipment

Delete all

Modelling of thermal phenomena in electronic nanosystems.

2016/21/B/ST7/02247

Keywords:

electronic nanosystems thermal modelling

Descriptors:

  • ST7_5: Micro- and nanelectronic, optoelectronic and photonic components
  • ST7_3: Simulation engineering and modelling
  • ST7_2: Electrical engineering: power components and/or systems

Panel:

ST7 - Systems and communication engineering: electronics, communication, optoelectronics

Host institution :

Politechnika Łódzka, Wydział Elektrotechniki, Elektroniki, Informatyki i Automatyki

woj. łódzkie

Other projects carried out by the institution 

Principal investigator (from the host institution):

prof. Andrzej Napieralski 

Number of co-investigators in the project: 10

Call: OPUS 11 - announced on 2016-03-15

Amount awarded: 827 100 PLN

Project start date (Y-m-d): 2017-04-10

Project end date (Y-m-d): 2021-04-09

Project duration:: 48 months (the same as in the proposal)

Project status: Project settled

Project description

Download the project description in a pdf file

Note - project descriptions were prepared by the authors of the applications themselves and placed in the system in an unchanged form.

Equipment purchased [PL]

  1. Komputer wraz z oprogramowaniem Matlab do opracowania algorytmów estymacji parametrów modeli oraz uzyskiwania rozwiązań analitycznych. (12 000 PLN)
  2. Komputer do przeprowadzania symulacji termicznych z wykorzystaniem metody różnic skończonych. (8 000 PLN)
  3. Komputer wraz z licencją i oprogramowaniem do symulacji komputerowych Metodą Elementów Skończonych: COMSOL lub SOLIDWORKS (30 000 PLN)
  4. Komputer o dużej mocy obliczeniowej waraz z oprogramowaniem COMSOL. (14 000 PLN)
  5. Komputer wraz z licencją i oprogramowaniem do symulacji komputerowych Metodą Elementów Skończonych: FlexPDE.

Information in the final report

  • Publication in academic press/journals (5)
  • Articles in post-conference publications (9)
  1. Influence of temperature and heat flux time lags on the temperature distribution in modern GAAFET structure based on Dual-Phase-Lag thermal model
    Authors:
    Tomasz Raszkowski, Agnieszka Samson, Mariusz Zubert
    Academic press:
    Microelectronics Reliability (rok: 2018, tom: Volume 86, strony: Pages 10-19), Wydawca: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.microrel.2018.05.004 - link to the publication
  2. Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs
    Authors:
    Mariusz Zubert, Tomasz Raszkowski, Agnieszka Samson, Piotr Zając
    Academic press:
    Microelectronics Reliability (rok: 2018, tom: Volume 91, strony: Pages 139-153), Wydawca: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.microrel.2018.07.141 - link to the publication
  3. Analysis of Algorithm Efficiency for Heat Diffusion at Nanoscale Based on a MEMS Structure Investigation
    Authors:
    Raszkowski Tomasz,Zubert Mariusz
    Academic press:
    Energies (rok: 2020, tom: 13, strony: 15), Wydawca: MDPI
    Status:
    Published
    DOI:
    10.3390/en13102520 - link to the publication
  4. Investigation of Heat Diffusion at Nanoscale Based on Thermal Analysis of Real Test Structure
    Authors:
    Raszkowski Tomasz,Zubert Mariusz:
    Academic press:
    Energies (rok: 2020, tom: 13, strony: 18), Wydawca: MDPI
    Status:
    Published
    DOI:
    10.3390/en13092379 - link to the publication
  5. Active calibration reference of minimized height for characterization of scanning thermal microscopy systems
    Authors:
    Paweł Janus, Dariusz Szmigiel, Andrzej Sierakowski, Maciej Rudek, Teodor Gotszalk
    Academic press:
    Ultramicroscopy (rok: 2021, tom: 221, strony: 188-191), Wydawca: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.ultramic.2020.113188 - link to the publication
  1. Analysis of Heat Transfer Processes in Electronic Nanostructures Using The Dual-Phase-Lag Model
    Authors:
    Marcin Janicki, Artur Sobczak, Grzegorz Jabłoński
    Conference:
    28th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES) (rok: 2021, ), Wydawca: IEEE
    Data:
    konferencja 24-26 June
    Status:
    Published
  2. Assessment of Different Methodologies for The Estimation of DPL Model Parameter Values for Dynamic Thermal Simulations of Nanoscale Electronic Structures
    Authors:
    Marcin Janicki, Mariusz Zubert, Piotr Zajac, Tomasz Raszkowsk, Jedrzej Topilko, Piotr Pietrzak, Grzegorz Jablonski, Agnieszka Samson, Andrzej Napieralski
    Conference:
    24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (rok: 2018, ), Wydawca: IEEE
    Data:
    konferencja 26-28 September
    Status:
    Published
  3. Manufacturing and Characterization of Test Structures Dedicated for The Investigation of Heat Transfer Processes at Nanoscale
    Authors:
    J. Topiłko, A. Sobczak, P. Pietrzak, P. Zając, M. Janicki, P. Janus, M. Zubert, A. Napieralski
    Conference:
    25th International Workshop on Thermal Investigations of ICs and Systems THERMINIC (rok: 2019, ), Wydawca: IEEE
    Data:
    konferencja 25-27 September
    Status:
    Published
  4. Measurement and Modeling of Heat Conduction in MEMS Nanostructures
    Authors:
    Marcin Janicki, Paweł Janus, Piotr Pietrzak, Piotr Zajac, Grzegorz Jablonski, Artur Sobczak, Jedrzej Topiłko, Andrzej Napieralski
    Conference:
    17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (rok: 2018, ), Wydawca: IEEE
    Data:
    konferencja May 29 - June 1
    Status:
    Published
  5. Comparison of temperature distributions in modern nanostructures based on different parameters of Dual-Phase-Lag equation
    Authors:
    Tomasz Raszkowski, Agnieszka Samson, Mariusz Zubert, Marcin Janicki
    Conference:
    20th IEEE Electronics Packaging Technology Conference (EPTC) (rok: 2018, ), Wydawca: IEEE
    Data:
    konferencja 4-7 Dec.
    Status:
    Published
  6. Manufacturing and Characterisation of MEMS Test Nanostructures
    Authors:
    Grzegorz Jabłoński, Paweł Janus, Piotr Pietrzak, Tomasz Torzewicz, Artur Sobczak, Marcin Janicki, Andrzej Napieralski, Andrzej Sierakowski, Anna Brzezińska, Piotr Prokaryn
    Conference:
    23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (rok: 2017, ), Wydawca: IEEE
    Data:
    konferencja 27-29 September
    Status:
    Published
  7. Measurement and Simulation of Test Structures Dedicated to the Investigation of Heat Diffusion at Nanoscale,
    Authors:
    M. Janicki, J. Topilko, A. Sobczak, P. Zajac, P. Pietrzak, A. Napieralski
    Conference:
    20th Annual International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE (rok: 2019, ), Wydawca: IEEE
    Data:
    konferencja March 24-27
    Status:
    Published
  8. Determining Parameters of the Dual-Phase-Lag Model of Heat Flow
    Authors:
    Mariusz Zubert, Tomasz Raszkowski, Jędrzej Topiłko, Łukasz Starzak, Grzegorz Jabłoński Paweł Janus, Marcin Janicki, Andrzej Napieralski
    Conference:
    25th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES) (rok: 2018, ), Wydawca: IEEE
    Data:
    konferencja 21-23 June
    Status:
    Published
  9. Measurement and Simulation of MEMS Dedicated to Investigation of Heat Transfer at Nanoscale
    Authors:
    Marcin Janicki, Piotr Pietrzak, Jedrzej Topilko, Piotr Zajac, Artur Sobczak, Grzegorz Jablonski, Pawel Janus, Piotr Prokaryn, Andrzej Napieralski
    Conference:
    19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (rok: 2018, ), Wydawca: IEEE
    Data:
    konferencja 15-18 April
    Status:
    Published