Projects funded by the NCN

Information on the principal investigator and host institution

Information of the project and the call

Keywords

Equipment

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Modelling nonlinear thermal phenomena in electronic systems

2013/11/B/ST7/01678

Keywords:

electronic systems nonlinear thermal modelling

Descriptors:

  • ST7_3: Simulation engineering and modelling
  • ST7_5: Micro- and nanelectronic, optoelectronic and photonic components
  • ST7_2: Electrical engineering: power components and/or systems

Panel:

ST7 - Systems and communication engineering: electronics, communication, optoelectronics

Host institution :

Politechnika Łódzka, Wydział Elektrotechniki, Elektroniki, Informatyki i Automatyki

woj. łódzkie

Other projects carried out by the institution 

Principal investigator (from the host institution):

dr hab. Marcin Janicki 

Number of co-investigators in the project: 7

Call: OPUS 6 - announced on 2013-09-16

Amount awarded: 709 640 PLN

Project start date (Y-m-d): 2014-09-19

Project end date (Y-m-d): 2017-09-18

Project duration:: 36 months (the same as in the proposal)

Project status: Project settled

Equipment purchased [PL]

  1. Komputerowy zestaw pomiarowy (3 000 PLN)
  2. Zestaw komputerowy do optymalizacji kompaktowych modeli termicznych (12 000 PLN)
  3. Tester termiczny układów elektronicznych (285 600 PLN)
  4. Zestaw komputerowy do symulacji termicznych (5 000 PLN)

Information in the final report

  • Publication in academic press/journals (3)
  • Articles in post-conference publications (19)
  1. Analysis of nonlinear heat exchange phenomena in natural convection cooled electronic systems
    Authors:
    G. De Mey, T. Torzewicz, P. Kawka, A. Czerwoniec, M. Janicki, A. Napieralski
    Academic press:
    Microelectronics Reliability (rok: 2016, tom: vol. 67, strony: pp. 9-14), Wydawca: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.microrel.2016.11.003 - link to the publication
  2. Comparison of Green's function solutions for different heat conduction models in electronic nanostructures
    Authors:
    M. Janicki, A. Samson, T. Raszkowski, M. Zubert, A. Napieralski
    Academic press:
    Microelectronics Journal (rok: 2015, tom: 46, strony: 1162-1166), Wydawca: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.mejo.2015.07.008 - link to the publication
  3. Experimental investigation of discrete air cooled device thermal resistance dependence on cooling conditions
    Authors:
    M. Janicki, T. Torzewicz, A. Samson, T. Raszkowski, A. Sobczak, M. Zubert, A. Napieralski
    Academic press:
    Microelectronics Reliability (rok: 2017, tom: vol. 79, strony: 405-409), Wydawca: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.microrel.2017.05.008 - link to the publication
  1. Application of ant colony optimization algorithm to the thermal parameter estimation of modern electronic structures
    Authors:
    T. Raszkowski, A. Samson, M. Zubert, M. Janicki, A. Napieralski
    Conference:
    Proc. of TechConnect World Innovation Conference (rok: 2016, ), Wydawca: TechConnect
    Data:
    konferencja May 22-25
    Status:
    Published
  2. Compact thermal modelling of packages containing multiple devices
    Authors:
    T. Torzewicz, A. Czerwoniec, M. Janicki, A. Napieralski
    Conference:
    Proceedings of 17th IEEE Electronics Packaging Technology Conference EPTC (rok: 2015, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja 2-4 December
    Status:
    Published
  3. Investigation of Heat Transfer Coefficient Variation in Air Cooled Hybrid Electronic Circuits
    Authors:
    [170]Tomasz Torzewicz, Agnieszka Samson, Tomasz Raszkowski, Marcin Janicki, Mariusz Zubert, and Andrzej Napieralski
    Conference:
    Proceedings of 22nd International Workshop on Thermal Investigations of ICs and Systems THERMINIC (rok: 2016, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja 21-23 September 2016
    Status:
    Published
  4. Application of dual-phase-lag model for thermal analyses of electronic nanostructures
    Authors:
    M. Janicki, M. Zubert, A. Samson, A. Napieralski
    Conference:
    Proceedings of TechConnect World Innovation Conference and Expo (rok: 2015, ), Wydawca: TechConnect
    Data:
    konferencja June 14-17
    Status:
    Published
  5. Numerical solution of 1-D DPL heat transfer equation
    Authors:
    T. Raszkowski, M. Zubert, M. Janicki, A. Napieralski
    Conference:
    Proceedings of 22nd International Conference Mixed Design of Integrated Circuits and Systems MIXDES (rok: 2015, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja 25-27 June
    Status:
    Published
  6. The Thermal Model of Fin-FET Transistor
    Authors:
    M. Zubert, M. Janicki, T. Raszkowski, A. Napieralski
    Conference:
    Proceedings of 21st International Workshop on Thermal Investigations of ICs and Systems THERMINIC (rok: 2015, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja 30 September - 2 October
    Status:
    Published
  7. Time Constant Spectra Based Fitting of Thermal Model Parameters
    Authors:
    T. Raszkowski, A. Samson, T. Torzewicz, P. Zając, A. Sobczak, M. Janicki, M. Zubert, A. Napieralski
    Conference:
    Proceedings of 23rd International Workshop on Thermal Investigations of ICs and Systems THERMINIC (rok: 2017, ), Wydawca: IEEE
    Data:
    konferencja 27-29 September
    Status:
    Published
  8. Thermal Analysis of Hybrid Circuits with Variable Heat Transfer Coefficient
    Authors:
    T. Torzewicz, A. Samson, T. Raszkowski, A. Sobczak, M. Janicki, M. Zubert, A. Napieralski
    Conference:
    Proceedings of 33rd IEEE Semiconductor Thermal Measurement, Modeling and Management Symposium SEMI-THERM (rok: 2017, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja 13-17 March
    Status:
    Published
  9. Advanced stand for transient thermal measurements
    Authors:
    T. Torzewicz, A. Sobczak, M. Janicki, A. Napieralski
    Conference:
    Proceedings of 30th International Conference on Microelectronics MIEL (rok: 2017, ), Wydawca: IEEE
    Data:
    konferencja 9-11 October
    Status:
    Published
  10. Comparative Analysis of Compact Thermal Models Generated from Measured Thermal Responses and Detailed Thermal Models
    Authors:
    T. Raszkowski, A. Samson, T. Torzewicz, P. Zając, M. Janicki, M. Zubert, A. Napieralski
    Conference:
    Proceedings of 24th International Conference Mixed Design of Integrated Circuits and Systems MIXDES (rok: 2017, ), Wydawca: IEEE
    Data:
    konferencja 22-24 June 2017
    Status:
    Published
  11. Determination of average heat transfer coefficient value in compact thermal models
    Authors:
    Agnieszka Samson, Marcin Janicki, Tomasz Raszkowski, Mariusz Zubert
    Conference:
    Proceedings of 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (rok: 2016, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja 18-20 April 2016
    Status:
    Published
  12. Estimation of heat transfer coefficient temperature dependence from cooling curve measurements
    Authors:
    A. Czerwoniec, T. Torzewicz, A. Samson, M. Janicki
    Conference:
    Proceedings of 22nd International Conference Mixed Design of Integrated Circuits and Systems MIXDES (rok: 2015, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja 25-27 June
    Status:
    Published
  13. Green's Function Solution for Dual-Phase-Lag Heat Conduction Model in Electronic Nanostructures
    Authors:
    M. Janicki, M. Zubert, A. Samson, T. Raszkowski, A. Napieralski
    Conference:
    Proceedings of 31st IEEE Semiconductor Thermal Measurement, Modeling and Management Symposium SEMI-THERM (rok: 2015, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja March 15-19, 2015
    Status:
    Published
  14. Identification of Nonlinearities Based on Comparison of Device Heating and Cooling Curves
    Authors:
    T. Torzewicz, A. Czerwoniec, M. Janicki, A. Napieralski
    Conference:
    Proceedings of 21st International Workshop on Thermal Investigations of ICs and Systems (rok: 2015, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja 30 September - 2 October
    Status:
    Published
  15. Investigation of internal package structure based on the analysis of dynamic temperature response
    Authors:
    Marcin Janicki, Tomasz Torzewicz, Andrzej Napieralski
    Conference:
    Proceedings of 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITherm (rok: 2016, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja May 30 - June 3, 2016
    Status:
    Published
  16. Modelling of average radiation and convection heat transfer coefficient value in electronic systems
    Authors:
    A. Samson, T. Torzewicz, T. Raszkowski, M. Janicki, M. Zubert, A. Napieralski
    Conference:
    Proc. of 23rd International Conference Mixed Design of Integrated Circuits and Systems MIXDES (rok: 2016, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja 23-25 June 2016
    Status:
    Published
  17. Numerical Analysis of 3D Model Order Reduction Based on Second-Order Dual-Phase-Lag Heat Transfer Equation
    Authors:
    T. Raszkowski, A. Samson, M. Zubert, M. Janicki, A. Napieralski
    Conference:
    Proceedings 23rd International Workshop on Thermal Investigations of ICs and Systems THERMINIC (rok: 2017, ), Wydawca: IEEE
    Data:
    konferencja 27-29 September
    Status:
    Published
  18. Structure-Aware Thermal Model Reduction
    Authors:
    T. Raszkowski, A. Samson, M. Zubert, M. Janicki, A. Napieralski
    Conference:
    Proceedings of 33rd IEEE Semiconductor Thermal Measurement, Modeling and Management Symposium SEMI-THERM (rok: 2017, ), Wydawca: IEEE Conference Publications
    Data:
    konferencja 13-17 March
    Status:
    Published
  19. Thermal Simulation of Hybrid Circuits with Variable Heat Transfer Coefficient
    Authors:
    T. Torzewicz, A. Samson, T. Raszkowski, A. Sobczak, M. Janicki, M. Zubert, A. Napieralski
    Conference:
    Proceedinggs of 18th Intemational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (rok: 2017, ), Wydawca: IEEE
    Data:
    konferencja 2-5 April
    Status:
    Published

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