Projects funded by the NCN

Information on the principal investigator and host institution

Information of the project and the call

Keywords

Equipment

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Generation of non-linear dynamic compact thermal models of electronic systems and semiconductor devices based on knowledge of their temperature response

2013/09/N/ST7/04069

Keywords:

compact themal models multi-channel measurements automatic controll of cooling conditions

Descriptors:

  • ST7_3: Simulation engineering and modelling
  • ST7_2: Electrical engineering: power components and/or systems
  • ST7_4: Micro- and nanosystems engineering

Panel:

ST7 - Systems and communication engineering: electronics, communication, optoelectronics

Host institution :

Politechnika Łódzka, Wydział Elektrotechniki, Elektroniki, Informatyki i Automatyki

woj. łódzkie

Other projects carried out by the institution 

Principal investigator (from the host institution):

Tomasz Torzewicz 

Number of co-investigators in the project: 2

Call: PRELUDIUM 5 - announced on 2013-03-15

Amount awarded: 88 700 PLN

Project start date (Y-m-d): 2014-04-01

Project end date (Y-m-d): 2017-03-31

Project duration:: 36 months (the same as in the proposal)

Project status: Project settled

Equipment purchased [PL]

  1. Komputer przenośny z systemem operacyjnym (4 864 PLN)

Information in the final report

  • Publication in academic press/journals (2)
  • Articles in post-conference publications (11)
  1. Analysis of nonlinear heat exchange phenomena in natural convection cooled electronic system
    Authors:
    Gilbert De Mey, TomaszTorzewicz, Piotr Kawka, Andrzej Czerwoniec, Marcin Janicki, Andrzej Napieralski
    Academic press:
    Microelectronics Reliability (rok: 2016, tom: 67, strony: 15-20), Wydawca: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.microrel.2016.11.003 - link to the publication
  2. Experimental investigation of discrete air cooled device thermal resistance dependence on cooling conditions
    Authors:
    Marcin Janicki, Tomasz Torzewicz, Agnieszka Samson, Tomasz Raszkowski, Artur Sobczak, Mariusz Zubert, Andrzej Napieralski
    Academic press:
    Microelectronics Reliability (rok: 2017, tom: 79, strony: 405-409), Wydawca: Elsevier
    Status:
    Published
    DOI:
    10.1016/j.microrel.2017.05.008 - link to the publication
  1. Retrieving Heat Transfer Coefficient Temperature Dependence from Measurement Data
    Authors:
    Tomasz Torzewicz, Andrzej Czerwoniec, Marcin Janicki, Andrzej Napieralski
    Conference:
    2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (rok: 2015, ), Wydawca: IEEE
    Data:
    konferencja 15-19 March 2015
    Status:
    Published
  2. Estimation of Heat Transfer Coefficient Temperature Dependence from Cooling Curve Measurements
    Authors:
    Andrzej Czerwoniec, Tomasz Torzewicz, Agnieszka Samson, Marcin Janicki
    Conference:
    2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES) (rok: 2015, ), Wydawca: IEEE
    Data:
    konferencja 25-27 June 2015
    Status:
    Published
  3. Investigation of heat transfer coefficient variation in air cooled hybrid electronic circuits
    Authors:
    Tomasz Torzewicz; Agnieszka Samson; Tomasz Raszkowski; Marcin Janicki; Mariusz Zubert; Andrzej Napieralski
    Conference:
    2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (rok: 2016, ), Wydawca: IEEE
    Data:
    konferencja 21-23 Sept. 2016
    Status:
    Published
  4. Identification of Nonlinearities Based on Comparison of Device Heating and Cooling Curves
    Authors:
    Tomasz Torzewicz, Andrzej Czerwoniec, Marcin Janicki, Andrzej Napieralski
    Conference:
    2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (rok: 2015, ), Wydawca: IEEE
    Data:
    konferencja 30 Sept.-2 Oct. 2015
    Status:
    Published
  5. Investigation of internal package structure based on the analysis of dynamic temperature response
    Authors:
    Marcin Janicki; Tomasz Torzewicz; Andrzej Napieralski
    Conference:
    2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (rok: 2016, ), Wydawca: IEEE
    Data:
    konferencja 31 May-3 June 2016
    Status:
    Published
  6. Modelling of average radiation and convection heat transfer coefficient value in electronic systems
    Authors:
    Agnieszka Samson; Tomasz Torzewicz; Tomasz Raszkowski; Marcin Janicki; Mariusz Zubert; Andrzej Napieralski
    Conference:
    23rd International Conference Mixed Design of Integrated Circuits and Systems, 2016 MIXDES (rok: 2016, ), Wydawca: IEEE
    Data:
    konferencja 23-25 June 2016
    Status:
    Published
  7. Compact Thermal Modelling of Packages Containing Multiple Devices
    Authors:
    Tomasz Torzewicz, Andrzej Czerwoniec, Marcin Janicki, and Andrzej Napieralski
    Conference:
    2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (rok: 2015, ), Wydawca: IEEE
    Data:
    konferencja 2-4 Dec. 2015
    Status:
    Published
  8. Advanced Stand for Transient Thermal Measurements
    Authors:
    Tomasz Torzewicz; Artur Sobczak; Marcin Janicki; Andrzej Napieralski
    Conference:
    2017 IEEE 30th International Conference on Microelectronics (MIEL) (rok: 2017, ), Wydawca: IEEE
    Data:
    konferencja 9-11 Oct. 2017
    Status:
    Published
  9. Estimation of Average Convective of Heat Transfer Coefficient in Electronic Systems
    Authors:
    Tomasz Raszkowski, Agnieszka Samson, Tomasz Torzewicz, Marcin Janicki, Mariusz Zubert, Mariusz Felczak
    Conference:
    23rd International Conference Mixed Design of Integrated Circuits and Systems, 2016 MIXDES (rok: 2016, ), Wydawca: IEEE
    Data:
    konferencja 23-25 June 2016
    Status:
    Published
  10. Thermal analysis of hybrid circuits with variable heat transfer coefficient
    Authors:
    Tomasz Torzewicz, Agnieszka Samson, Tomasz Raszkowski, Artur Sobczak,Marcin Janicki, Mariusz Zubert and Andrzej Napieralski
    Conference:
    2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (rok: 2017, ), Wydawca: IEEE
    Data:
    konferencja 13-17 March 2017
    Status:
    Published
  11. Thermal simulation of hybrid circuits with variable heat transfer coefficient
    Authors:
    Tomasz Torzewicz; Agnieszka Samson; Tomasz Raszkowski; Artur Sobczak; Marcin Janicki; Mariusz Zubert; Andrzej Napieralski
    Conference:
    2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (rok: 2017, ), Wydawca: IEEE
    Data:
    konferencja 3-5 April 2017
    Status:
    Published

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