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Copper conductive lines with glass insulation by a melt extrusion process

2022/04/Y/ST7/00151

Keywords:

melt extrusion process copper glass electrical properties adhesion interface

Descriptors:

  • ST7_005:
  • ST7_004:

Panel:

ST7 - Systems and communication engineering: electronics, communication, optoelectronics

Host institution :

Politechnika Wrocławska

woj.

Other projects carried out by the institution 

Principal investigator (from the host institution):

prof. Jarosław Krzysztof Domaradzki 

Number of co-investigators in the project:

Amount awarded: 605 866 PLN

Project start date (Y-m-d): 2023-05-26

Project end date (Y-m-d): 2026-05-25

Project duration:: 36 months (the same as in the proposal)

Project status: Pending project